Module Outline
Date retreived
22/07/2026 2:55 PM AWST
22/07/2026 2:55 PM AWST
Whilst all efforts are made to provide accurate and timely information from the relevant source/documentation, please be aware that the information supplied may not be the most current version. The accuracy of the detail has not been confirmed by the Department and therefore should not be relied upon without first confirming the contents.
Ball Grid Array (Bga) and Micro Ball Grid Array (Micro Bga) Soldering Skills
Ball Grid Array (Bga) and Micro Ball Grid Array (Micro Bga) Soldering Skills
Module
National Code
State Code
33074
33074
DTWD Status
Approved
Approved
State Implementation and Classification
Approved Date
18/01/2002
Field of Education
Nominal Hours
36
Description
No information
No information
Elements and Performance Criteria
No information
No information
Associated Qual/Courses
| State Code | National Code | Title | Type |
|---|---|---|---|
| 5419 | 23315 | Certificate III in Communication Technology | Accredited course |