Unit of competency Outline
Date retreived
23/07/2026 4:43 AM AWST
23/07/2026 4:43 AM AWST
Whilst all efforts are made to provide accurate and timely information from the relevant source/documentation, please be aware that the information supplied may not be the most current version. The accuracy of the detail has not been confirmed by the Department and therefore should not be relied upon without first confirming the contents.
Manufacture wafer products
Manufacture wafer products
Unit of competency
National Code
FBPPBK2004
FBPPBK2004
State Code
BBG01
BBG01
TGA Status
Replaced
Replaced
DTWD Status
Replaced
Replaced
State Implementation and Classification
Approved Date
27/07/2018
Field of Education
030717 - Plant And Machine Operations
Original Release Date
27/07/2018
Nominal Hours
30
Description
This unit of competency describes the skills and knowledge required to set up, operate, adjust and shut down a wafer products manufacturing process.This unit applies to individuals who work in a baking production environment under general supervision with some accountability for their own work. This includes identifying and providing solutions to a limited range of predictable problems relating to the operation and monitoring of machines and equipment used in the wafer manufacturing process.All work must be carried out to comply with workplace procedures, in accordance with State/Territory work health and safety, and food safety regulations, legislation and standards that apply to the workplace.No occupational licensing, legislative or certification requirements apply to this unit at the time of publication.
Notes
Elements and Performance Criteria
1. Prepare the wafer process for operation
- 1.1 Read or listen to work instructions from supervisor and clarify where needed
- 1.2 Identify work health and safety hazards and report to supervisor
- 1.3 Wear appropriate personal protective equipment and ensure correct fit
- 1.4 Confirm availability of materials to meet production requirements
- 1.5 Identify and confirm cleaning and maintenance requirements have been met
- 1.6 Fit machine components and related attachments and adjust to meet operating requirements
- 1.7 Select processing and operating parameters to meet safety and production requirements
- 1.8 Check equipment and adjust according to manufacturer instructions to ensure optimum performance
- 1.9 Carry out pre-start checks according to operator instructions
2. Operate and monitor the wafer process
- 2.1 Start the wafer products manufacturing process according to workplace procedures
- 2.2 Monitor equipment to identify variation in operating conditions and report variations in equipment operation
- 2.3 Monitor the process to confirm that product meets specifications
- 2.4 Identify, rectify and report out-of-specification product and process outcomes
- 2.5 Conduct work and maintain a clean and tidy workplace according to workplace environmental guidelines
3. Shut down the process
- 3.1 Identify the appropriate shutdown procedure and implement
- 3.2 Identify and report maintenance requirements
- 3.3 Maintain workplace records accurately according to workplace procedures
No information
No information
Replaces
| State Code | National Code | Title | Type |
|---|---|---|---|
| D4514 | FDFBK2004A | Manufacture wafer products | Unit of competency |
Replaced By
| State Code | National Code | Title | Type |
|---|---|---|---|
| ODL01 | FBPHVB3004 | Manufacture wafer products | Unit of competency |
| State Code | National Code | Title | Type |
|---|---|---|---|
| BDO8 | FBP20117 | Certificate II in Food Processing | Qualification |
| BDP2 | FBP20317 | Certificate II in Food Processing (Sales) | Qualification |